In-mould structural electronics (IMSE)
The field of smart products is developing rapidly, resulting in a strong need for innovative techniques to integrate sensing, lighting, communication or signal processing functions into physical objects. Amongst these, in-mould structural electronics (IMSE) allows for ultimate levels of miniaturisation, great design freedom and high degrees of robustness for the integration of electronics into 3D polymer products.
Combining the advantages of printed electronics and thermoplastic film overmoulding, this technique is a game changer compared to traditional integration approaches. Already implemented for demanding sectors such as automotive, it can be applied in other areas such as medical or household technologies.
IMSE allows designers to develop products that are more aesthetically appealing, slimmer and lighter, while increasing their durability compared to products manufactured using more conventional methods. This approach can also be implemented thanks to a rather limited and/or incremental adaptation of traditional polymer replication facilities.
During this express webinar (30 minutes), you will discover the different steps of a typical IMSE process, as well as various examples of applications of this technology.